December 15, 2015

SBA Materials raises D round of financing -  SAN JOSE, Calif.–(BUSINESS WIRE)–SBA Materials Inc., a leader in development of engineered nano-structured dielectrics, has announced the successful closing of its Series D financing round. New investors in this round were Air Liquide Venture Capital (ALIAD) and Tokyo Electron Venture Capital Inc. Also participating were existing investors Intel Capital, Samsung Venture Investment Corporation and Sun Mountain Capital.